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Mode-Field Matched Fiber Array – UHNA Fiber to SMF-28, Low Loss Coupling for Silicon Photonic Integrated Circuits (PIC)
Détails sur le produit:
| Lieu d'origine: | ShenZhen et ZhongShan, Chine |
| Nom de marque: | DF/OEM/Nuetral |
| Certification: | CE/ROHS/CPR EN50575/ISO9001 /ISO14001 |
| Numéro de modèle: | Réseau de fibres adapté au MFD |
Conditions de paiement et expédition:
| Quantité de commande min: | 1 |
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| Prix: | can be negotiated |
| Détails d'emballage: | Carton |
| Délai de livraison: | 5-9 jours ouvrables dépendent de la quantité |
| Conditions de paiement: | T/T, Western Union, PayPal |
| Capacité d'approvisionnement: | 1000 PC/jours |
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Détail Infomation |
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| Mettre en évidence: | UHNA fiber array for silicon PIC,low loss SMF-28 fiber array,mode-field matched fiber coupler |
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Description de produit
Mode-Field Matched Fiber Array
UHNA Fiber to SMF-28, Low Loss Coupling for Silicon Photonic Integrated Circuits (PIC)
Product Overview
The MFD Matched Fiber Array is a precision optical component designed to solve the mode field mismatch between standard single-mode fibers (MFD ~10μm) and silicon photonic waveguides (MFD ~3-5μm). It integrates UHNA (Ultra-High Numerical Aperture) fibers with standard SMF-28 fibers via high-precision fusion splicing, creating a seamless mode field transition within a compact V-groove array package.
When standard 10μm fibers are directly aligned with silicon waveguides, coupling efficiency is extremely low due to mode field mismatch. The MFD matched fiber array acts as a mode field converter - the UHNA fiber section gradually compresses the optical mode from 10μm down to 3-5μm, enabling high-efficiency coupling to silicon photonic chips.
Key Features
Why Choose TAKFLY?
26 Years of Manufacturing Experience in Fiber Optic Products
- Experienced Assembly Team: More than 80 assembly workers with 6+ years of experience
- Strong R&D Capability: More than 10 R&D engineers
- Advanced Production Equipment: 16 sets of German imported injection machines and 16 production lines
- Comprehensive Testing Facilities: More than 30 sets of testing instruments, including OTDR, ILD, VFL, RL, IL, tension strength testers, crush resistance testers, power meter testers, light checkers, etc.
- OEM Branding Accepted: Custom logo/branding available
Quality Control Process
- Incoming inspection: Spot check of raw materials before production
- In-process inspection: Full inspection at every individual process completion
- Pre-packaging inspection: Full inspection of finished products before packing
- Pre-shipping inspection: Spot check before shipping
Industry Presence
Active participation in major industry exhibitions including Source Electronics Exhibition, OFC, FOCC, ConnecAsia, NFTCOM, AFRICACOM, SMART ICT, Contelem, and events in China.
Delivery Information
| Service Type | Timeline |
|---|---|
| Samples | 1-3 working days |
| Mass production orders | 3-7 working days |
Packaging: Plastic bag, carton, and pallet options available according to your requirements.
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